Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IEC 91/895/CD:2009)
€111.40
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 91/890/CD:2009)
€105.42
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/896/CD:2009)
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/889/CD:2009)
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997 + A1:1999); German version EN 61189-3:1997 + A1:1999.
€162.06
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (includes Amendment A1:2000) (IEC 61189-2:1997 + A1:2000); German version EN 61189-2:1997 + A1:2000.
€214.30
Base materials for printed circuits - Part 2: Specifications; Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board (IEC 60249-2-17:1992 + A1:1993 + A2:1994 + A3:2000); German version EN 60249-2-17:1993 + A1:1994 + A2:1995 + A3:2000.
€69.91
Terms and definitions for printed circuits
€77.20
Terms and definifions for prinfed circuits
€41.78
Amendment to IEC 60249-2-17: Base materials for printed circuits - Part 2: Specifications; specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board; Amendment A3 (IEC 52/788/CDV:1998); German version EN 60249-2-17/prA3:1998
Printed board assemblies - Part 4: Sectional specification: Workmanship requirements for terminal soldered assembly (IEC 91/160/CD:1998)
Printed board assemblies - Part 2: Sectional specification: Workmanship requirements and guidelines for soldered surface mount electronic assemblies (IEC 91/158/CD:1998)
€179.53
IEC 61192-3: Printed board assemblies - Part 3: Sectional specification: Workmanship requirements for through-hole mount soldered assemblies (IEC 91/159/CD:1998)
€157.10
Materials for interconnection structures - Part 2-4: Sectional specification set for reinforced base materials, clad and unclad; polyester non-wowen/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 52/853/CDV:2000); German version prEN 61249-2-4:2000
€98.32
Materials for interconnection structures - Part 2-18: Sectional specification set for reinforced base materials clad and unclad; polyester non-woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 52/854/CDV:2000); German version prEN 61249-2-18:2000
€91.03
