Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997); German version EN 61189-3:1997.
€105.42
IEC 61761: Generic specification - Capability approval for surface mount technologies (IEC 91/119/CD:1997)
IEC 61249-2-19: Materials for interconnection structures - Part 2: Sectional specification set for reinforced base materials clad and unclad; section 19: High temperature epoxide cross-plied coherent linear fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 52/757/CDV:1997)
€77.20
Sectional specification - Capability approval of manufacturers of printed board assemblies of assessed quality; German version EN 160100:1997.
Printed Board Design, Manufacture and Assembly - Terms and Definitons (IEC 91/448/CDV:2004)
€385.89
Printed board and printed board assemblies - Design and use - Part 5-5: Sectional requirements - Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 91/465/CDV:2004); German version prEN 61188-5-5:2004
€134.02
Printed boards and printed board assemblies - Design and use - Part 5-4: Sectional requirements - Attachment (land/joint) consideration - Components with J leads on two sides (IEC 91/464/CDV:2004); German version prEN 61188-5-4:2004
€63.27
Printed boards and printed board assemblies - design and use - Part 5-3: Sectional requirements - attachment (land/joint) considerations - components with gull-wing leads on two sides (IEC 91/463/CDV:2004); German version prEN 61188-5-3:2004
€111.40
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 91/509/CD:2005)
Materials for interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (IEC 91/573/CDV:2005); German version prEN 61249-4-1:2005
€69.91
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 91/1089/FDIS:2013); German version FprEN 61191-1:2013
€150.65
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 91/1091/FDIS:2013); German version FprEN 61191-2:2013
€116.64
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/753/CD:2008)
Quality Assessment Systems - Part 3: Selection and use of sampling plans for Printed Board and Laminate end-product and in-process auditing (IEC 91/749/CD:2008)
€190.65
Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)
