31.180 : Printed circuits and boards

DIN IEC 91(Sec)27:1993-09

DIN IEC 91(Sec)27:1993-09

Withdrawn Most Recent

Test methods for soldering of surface mounting devices (SMDs); identical with IEC 91(Secretariat)27:1993

€84.58

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DIN IEC 60326-3:1993-09

DIN IEC 60326-3:1993-09

Withdrawn Most Recent

Printed boards; part 3: design and use of printed boards; identical with IEC 60326-3:1991

€105.42

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DIN IEC 60326-4:1993-09

DIN IEC 60326-4:1993-09

Withdrawn Most Recent

Printed boards; part 4: specification for single and double sided rigid printed boards with plain holes; identical with IEC 60326-4:1980 (status as of 1989)

€63.27

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DIN IEC 60326-5:1993-09

DIN IEC 60326-5:1993-09

Withdrawn Most Recent

Printed boards; part 5: specification for single and double sided printed boards with plated-through holes; identical with IEC 60326-5:1980 (status as of 1989)

€77.20

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DIN IEC 60326-2/A1:1993-10

DIN IEC 60326-2/A1:1993-10

Withdrawn Most Recent

Printed boards; part 2: test methods; identical with IEC 60326-2 A1:1992

€34.30

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DIN IEC 52(Sec)422:1993-11

DIN IEC 52(Sec)422:1993-11

Superseded Historical

IEC 61189-2: test methods for materials for interconnection structures, test M14: peel strength after heat shock (IEC 52(Secretariat)422:1993)

€41.78

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DIN IEC 52(Sec)425:1993-11

DIN IEC 52(Sec)425:1993-11

Superseded Historical

IEC 61189-2: test methods for materials for interconnection structures, test M17: peel strength at high temperature (IEC 52(Secretariat)425:1993)

€41.78

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DIN IEC 52(Sec)426:1993-11

DIN IEC 52(Sec)426:1993-11

Superseded Historical

IEC 61189-3: test methods for interconnection structures (printed boards), test M05: peel strength, flexible printed boards, STD (IEC 52(Secretariat)426:1993)

€41.78

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DIN EN 60249-2-16:1993-12

DIN EN 60249-2-16:1993-12

Superseded Historical

Base materials for printed circuits; part 2: specifications; specification No. 16: polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) (IEC 60249-2-16:1992); German version EN 60249-2-16:1993.

€63.27

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DIN EN 60249-2-17:1993-12

DIN EN 60249-2-17:1993-12

Superseded Historical

Base materials for printed circuits; part 2: specifications; specification No. 17: thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board (IEC 60249-2-17:1992 + corrigendum 1992); German version EN 60249-2-17:1993.

€56.17

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DIN EN 60249-2-18:1993-12

DIN EN 60249-2-18:1993-12

Superseded Historical

Base materials for printed circuits; part 2: specifications; specification No. 18: bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) (IEC 60249-2-18:1992); German version EN 60249-2-18:1993.

€63.27

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DIN EN 60249-2-19:1993-12

DIN EN 60249-2-19:1993-12

Withdrawn Most Recent

Base materials for printed circuits; part 2: specifications; specification No. 19: thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards (IEC 60249-2-19:1992); German version EN 60249-2-19:1993

€56.17

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DIN IEC 52(Sec)442:1994-03

DIN IEC 52(Sec)442:1994-03

Superseded Historical

IEC 1249-6-1: base materials for printed circuits; part 6: restraining core materials; specification No. 1: copper clad invar sheet for use in the fabrication of printed boards (IEC 52(Secretariat)442:1993)

€41.78

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DIN IEC 60326-7/A1:1994-04

DIN IEC 60326-7/A1:1994-04

Withdrawn Most Recent

Printed boards; part 7: specification for single and double sided flexible printed boards without through connections (IEC 60326-7 A1:1989)

€34.30

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DIN IEC 60326-8/A1:1994-04

DIN IEC 60326-8/A1:1994-04

Withdrawn Most Recent

Printed boards; part 8: specification for single and double sided flexible printed boards with through connections (IEC 60326-8 A1:1989)

€34.30

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