IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N11: Pre-conditioning, 125 °C (IEC 52(Secretariat)484:1994)
€34.30
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test X07: Edge dip test for surface mount conductors and attachment lands (IEC 52(Secretariat)485:1994)
€69.91
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test X10: Rotary dip test for plated through holes, surface mount conductors and attachment lands (IEC 52(Secretariat)486:1994)
€77.20
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E07: Controlled impedance testing by Time Domain Reflectometry (TDR) (IEC 52(Secretariat)476:1994)
€84.58
Printed boards; part 4: specification for single and double sided printed boards with plain holes
€63.27
Printed boards; part 5: specification for single and double sided printed boards with plated-through holes
Printed boards; part 6: specification for multilayer printed boards
€91.03
Printed boards; part 7: specification for single and double sided flexible printed boards without through connections
Printed circuits; rework, repair, modification; identical with IEC 52(CO)249
€48.79
Printed boards; specification for single and double sided flexible printed boards with through connections; identical with IEC 60326-8, edition 1981
Base materials for printed circuits; special materials; specification no. 1: prepreg for use as bonding sheet material in the fabrication of multilayer printed boards; identical with IEC 60249-3-1, edition 1981
Printed boards; artwork for production; identical with IEC 52(Central Office)303
€56.17
Printed boards - Part 1: Generic specification (IEC 62326-1:1996); German version EN 62326-1:1997.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997); German version EN 61189-1:1997.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:1997); German version EN 61189-2:1997 + Corrigendum:1997.
€116.64
