Base materials for printed circuits; part 1: test methods (IEC 60249-1:1982 + A4:1993); German version EN 60249-1:1993 + A4:1994
€111.40
Printed boards; part 6: specification for multilayer printed boards; identical with IEC 60326-6:1980 + A1:1983 + A2:1990
€91.03
Base materials for printed circuits - Part 2: Specifications; specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade (IEC 60249-2-4:1987 + A2:1992 + A3:1993); German version EN 60249-2-4:1994 + A3:1994.
€63.27
Base materials for printed circuits - Part 2: Specifications; specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) (IEC 60249-2-5:1987 + A2:1992 + A3:1993); German version EN 60249-2-5:1994 + A3:1994.
IEC 61189-2: Test methods for materials for interconnection structures - Test E04: Volume resistivity and surface resistivity (IEC 52(Secretariat)472:1994)
€48.79
IEC 61189-2: Test methods for materials for interconnection structures - Test E14: Arc resistance (IEC 52(Secretariat)473:1994)
IEC 61189-2: Test methods for materials for interconnection structures - Test M25: Time to delamination by TMA (IEC 52(Secretariat)474:1994)
€34.30
IEC 61189-2: Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards (IEC 52(Secretariat)475:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E08: PTH resistance change, thermal cycling (IEC 52(Secretariat)477:1994)
€56.17
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N01: Thermal shock, immersion, oil bath (IEC 52(Secretariat)478:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N04: Thermal shock, dip soldering (IEC 52(Secretariat)479:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N05: Thermal shock, floating, solder bath 280 °C (IEC 52(Secretariat)480:1994)
€41.78
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N06: Damp heat, steady state (IEC 52(Secretariat)481:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N08: Thermal shock, immersion fluidized sand bath (IEC 52(Secretariat)482:1994)
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test N10: Pre-conditioning, standard atmospheric conditions (IEC 52(Secretariat)483:1994)
