Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/669/CDV:2007); German version prEN 61249-4-17:2007
€69.91
Printed board and printed board assemblies - Design and use - Part 7: Sectional requirements - Electronic component zero orientation for CAD library construction (IEC 91/701/CDV:2007); German version prEN 61188-7:2007
€91.03
Evaluation criteria for voids in soldered joints of BGA and LGA (IEC 91/707/CD:2007)
€116.64
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/744/CD:2007)
€105.42
Printed boards - Part 3: Safety certification of rigid printed circuit boards for electronic assemblies (IEC 91/384/CD:2003)
€140.00
Materials for interconnection structures - Part 2-22: Sectional specification set for reinforced base material clad and unclad; Modified non-halogenated epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 91/396/CDV:2003); German version prEN 61249-2-22:2003
Materials for interconnection structures - Part 6-3: Sectional specification for reinforcements; Woven fibreglass fabrics (IEC 91/393/CD:2003)
Printed board and printed board assemblies - Design and use - Part 5-8 : Sectional Requirement - Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 91/416/CD:2003)
€111.40
Specification for metal clad base materials for printed circuits. Methods of test
€269.00
Printed wiring boards. Guide for the design and use of printed wiring boards
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024); German version EN IEC 61189-2-720:2024
€77.20
Digital data communications for measurement and control. Fieldbus use in industrial control systems Overview guidance the IEC 61158 series
€165.00
Guide to printed wiring (design, manufacture and repair)
This product is not for sale, please contact us for more information
Printed circuits; fundamental parameters, guidance for the design and use of components
€41.78
Metal-clad base materials for printed circuits; test methods
€56.17
