Materials for printed boards and other interconnection structures - Part 2-1: Sectional specification set for reinforced base materials, clad and unclad; Phenolic cellulose paper reinforced laminate sheet, economic grade, copper clad (IEC 91/316/CDV:2002); German version prEN 61249-2-1:2002
€84.58
Materials for printed boards and other interconnection structures - Part 2-2: Sectional specification set for reinforced base materials clad and unclad; Phenolic cellulose paper reinforced laminate, high electrical grade, copper clad (IEC 91/317/CDV:2002); German version prEN 61249-2-2:2002
Amendment 2 to IEC 61189-3: Test methods for electrical material, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 91/314/CD:2002)
€140.00
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 91/310/CD:2002)
€150.65
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (IEC 61189-2-809:2024); German version EN IEC 61189-2-809:2025
€77.20
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024
€105.42
Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-52:2025); German version EN IEC 61249-2-52:2025
Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 91/1978/CDV:2024); German and English version prEN IEC 61249-2-53:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 61189-2-808:2024); German version EN IEC 61189-2-808:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (IEC 61189-2-805:2024); German version EN IEC 61189-2-805:2024
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
This product is not for sale, please contact us for more information
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
€74.00
€58.00
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
