Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
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Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
BASE MATERIALS FOR PRINTED CIRCUITS. TEST METHODS.
€90.00
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATIION. NO. 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
€53.00
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COOPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
€58.00
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 7: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
