Metal-clad base material for printed circuits; specifications
€41.78
Printed circuits; printed boards, general requirements and tests
€69.91
Printed circuits; printed boards, drawings
€24.39
Terms and definitions for printed circuits
€77.20
Materials for interconnection structures - Part 2-26: Sectional specification set for reinforced base materials, clad and unclad; Section 26: Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 91/343/CD:2002)
€98.32
Materials for interconnection structures - Part 2-23: Sectional specification set for reinforced base materials, clad and unclad; Section 23: Non-halogenated phenolic cellulose paper reinforced laminate sheet, economic grade, copper clad (IEC 91/342/CD:2002)
€84.58
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) (IEC 91/353/CD:2002)
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (vertical burning test) (IEC 91/354/CD:2002)
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) (IEC 91/355/CD:2002)
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) (IEC 91/356/CD:2002)
Base materials for printed circuits; special materials; specification no. 2: copper foil for use in the manufacture of copper-clad base materials; identical with IEC 52(Secretariat)352
€63.27
Rack and panel connectors; trapeziodal, round contacts 1 mm; dimensions of type B; solder termination for printed board
€48.79
Printed board electronic data description and transfer; part 1: printed board description in digital form; identical with IEC 52(Central Office)363
Printed boards; part 12: specification for mass lamination panels (semi-manufactured multilayer printed boards); identical with IEC 12(Central Office)367
Printed boards; general information for the specification writer; identical with IEC 60326-1:1984
