31.190 : Electronic component assemblies

DIN IEC 61189-2/A2:2002-10

DIN IEC 61189-2/A2:2002-10

Superseded Historical

Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 91/313/CD:2002)

€122.34

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DIN IEC 61189-6:2002-11

DIN IEC 61189-6:2002-11

Superseded Historical

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies (IEC 91/315/CD:2002)

€116.64

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DIN IEC 61189-5:2002-11

DIN IEC 61189-5:2002-11

Superseded Historical

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 91/310/CD:2002)

€150.65

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DIN EN 61190-1-2:2003-01

DIN EN 61190-1-2:2003-01

Superseded Historical

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002.

€91.03

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DIN EN 61190-1-3:2003-01

DIN EN 61190-1-3:2003-01

Superseded Historical

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002); German version EN 61190-1-3:2002.

€116.64

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DIN EN IEC 63215-2:2025-03

DIN EN IEC 63215-2:2025-03

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Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (IEC 63215-2:2023); German version EN IEC 63215-2:2023

€111.40

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UNE-EN 60068-2-58:2006

UNE-EN 60068-2-58:2006

Superseded Historical

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

€77.00

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BS EN 61193-2:2007

BS EN 61193-2:2007

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Quality assessment systems Selection and use of sampling plans for inspection electronic components packages

€193.00

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BS EN 62137-1-1:2007

BS EN 62137-1-1:2007

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Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength

€193.00

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BS EN 62137-1-2:2007

BS EN 62137-1-2:2007

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Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength

€193.00

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BS EN 62421:2007

BS EN 62421:2007

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Electronics assembly technology. Electronic modules

€193.00

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BS EN 60194:2006

BS EN 60194:2006

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Printed board design, manufacture and assembly. Terms and definitions

€404.00

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PD IEC/TS 62878-2-1:2015

PD IEC/TS 62878-2-1:2015

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Device embedded substrate Guidelines. General description of technology

€316.00

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PD IEC/TS 62878-2-4:2015

PD IEC/TS 62878-2-4:2015

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Device embedded substrate Guidelines. Test element groups (TEG)

€316.00

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BS EN 62878-1-1:2015

BS EN 62878-1-1:2015

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Device embedded substrate Generic specification. Test methods

€374.00

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