Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies; identical with IEC 91(Secretariat)28:1993
€179.53
IEC 61188-1-1: design for printed boards and printed board assemblies; part 1: engineering consideration; section 1: flatness of electronic assemblies (IEC 52(Secretariat)435:1993)
€56.17
Generic specification: modular electronic units; German version EN 160000:1993
Technical Report; application of IEC 60617-12 and 60617-13; identical with IEC 3A(Secretariat)341:1993
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error rate testing of electronic components (IEC 47/1796/CD:2004)
€63.27
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solder for electronic soldering applications (IEC 91/521/CD:2005)
€116.64
Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005)
€91.03
Electronic Modules - Generic standard (IEC 91/546/CD:2005)
€77.20
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/809/CD:2008)
Amendment to IEC 60749 "Update of Chapter 2 subclause 2.3: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat" and of Chapter 3 clause 5: "Sealing"
€122.34
IEC 61192-1: Printed board assemblies - Part 1: Generic specification: Workmanship requirements and guidelines for soldered electronic assemblies (IEC 91/151/CD:1998)
€128.22
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007.
Printed board and printed board assemblies - Design and use - Part 7: Sectional requirements - Electronic component zero orientation for CAD library construction (IEC 91/701/CDV:2007); German version prEN 61188-7:2007
Product performance requirements - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 91/326/CD:2002)
Modular order for the development of mechanical structures for electronic equipment practices (IEC 60917:1988); german version EN 60917:1990
