Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications
€355.00
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on
€316.00
Environmental testing Tests. Test Te/Tc. Solderability of electronic components and printed boards by the wetting balance (force measurement) method
€374.00
Quality assessment systems Selection and use of sampling plans for printed board laminate end-product in-process auditing
Surface mounting technology Standard method for the specification of components through hole reflow (THR) soldering
€269.00
Instrument transformers Additional requirements for inductive voltage
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
€193.00
Attachment materials for electronic assembly Requirements soldering fluxes high-quality interconnections in electronics
Printed boards and assemblies. Design use. Attachment (land/joint) considerations Discrete components
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test methodology
Quality assessment systems Registration and analysis of defects on printed board assemblies
Test methods for electrical materials, interconnection structures and assemblies materials used in manufacturing electronic
Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular units assessed Index test methods
