Conduit systems for cable management Particular requirements. Flexible conduit
€193.00
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
€316.00
BS EN IEC 63215-2. Endurance test methods for die attach materials applied to power electronics devices Part 2. Temperature cycling method and reliability performance index Die discrete type electronic
€23.00
Endurance test methods for die attach materials Temperature cycling method applied to discrete type power electronic devices
€269.00
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling method (near chip interconnection) module type
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
€84.58
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025); German version EN IEC 62878-2-603:2025
€91.03
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies Part 1: requirements the circuit boards or with miniaturized SMDs where heat dissipation path to board is dominant
Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: conductivity of circuit boards with polymer composites
Draft BS IEC 62271-202/AMD1 ED3 Amendment 1 - High-voltage switchgear and controlgear
