BS EN IEC 63609-3 Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements Part 3: Determination for temperature measurement in using thermocouples
€23.00
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
€193.00
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
€269.00
Printed board assemblies Sectional specification. Requirements for surface mount soldered
€316.00
Circuit boards and circuit board assemblies. Design use 3D shape data for CAD component library
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Surface mounting technology Standard method for the specification of components through-hole reflow (THR) soldering
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Printed board assemblies Technical cleanliness of components and printed
€404.00
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
