Generic specification; fixed RF wound inductors; German version EN 129000:1993
€77.20
Sectional specification: wirewound surface mounting inductors; German version EN 129100:1993
€91.03
Blank detail specification: wirewound surface mounting inductors of assessed quality; assessment level E; German version EN 129101:1993
€48.79
Blank detail specification: Wirewound surface mounting inductors of assessed quality - Assessment level P; German version EN 129102:1994
€56.17
Blank detail specification: Wirewound surface mounting inductors of assessed quality - Assessment level E; German version EN 129101/A1:1994
Sectional specification: Fixed inductors with ceramic or ferrite core wound with copper wire for HF circuits; German version EN 129200:1994
€84.58
Blank detail specification: Wirewound inductors with ceramic or ferrite core - Assessment level E; German version EN 129201:1994
€63.27
Blank detail specification: Wirewound inductors with ceramic or ferrite core - Assessment level P; German version EN 129202:1994
Connectors for electronic equipment - Part 4-114: Printed board connectors - Detail specification for two-part connector with integrated shielding function having a grid of 1 mm × 1,5 mm (IEC 61076-4-114:2003); German version EN 61076-4-114:2003
€128.22
Connectors for electronic equipment - Tests and measurements - Part 2-2: Electrical continuity and contact resistance tests - Test 2b: Contact resistance - Specified test current method (IEC 60512-2-2:2003); German version EN 60512-2-2:2003.
€41.78
Connectors for electronic equipment - Tests and measurements - Part 2-5: Electrical continuity and contact resistance tests - Test 2e: Contact disturbance (IEC 60512-2-5:2003); German version EN 60512-2-5:2003.
Connectors for electronic equipment - Tests and measurements - Part 4-1: Voltage stress tests - Test 4a: Voltage proof (IEC 60512-4-1:2003); German version EN 60512-4-1:2003.
Semiconductor devices - Micro- electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin film (IEC 47F/78/CD:2011)
€111.40
Semiconductor devices - Micro-electromechanical devices - Part 18: Bending test methods of thin film materials (IEC 47F/76/CD:2011)
€69.91
Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011); German version EN 60352-8:2011
€105.42
