Connectors for frequencies below 3 MHz - Part 9: Circular connectors for radio and associated sound equipment (IEC 60130-9:2011); German version EN 60130-9:2011.
€162.06
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
€98.32
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 47F/88/CD:2011)
€116.64
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
€128.22
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
€111.40
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
€84.58
Electrical and electronic circuit breakers - Part 21: Single pole with galvanic disconnection, rated current 0,5 A to 50 A, without or with auxiliary switch, with thermal release, push-pull actuation, detail specification; Text in German and English.
€124.49
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories (IEC 60512-23-3:2000); German version EN 60512-23-3:2001, Corrigendum to DIN EN 60512-23-3:2001-11; (IEC-Cor.:2003 to IEC 60512-23-3:2000).
€0.00
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof) (IEC 60512-1-4:1997); German version EN 60512-1-4:1997, Corrigendum to DIN EN 60512-1-4:1998-02; (IEC-Cor. :2000 to IEC 60512-1-4:1997)
Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 3: Rectangular connectors - Section 101: Detail specification for a range of shielded connectors with trapezoidal shaped shells and non-removable rectangular contacts on a 1,27 mm x 2,54 mm centre-line (IEC 61076-3-101:1997); German version EN 61076-3-101:1997, Corrigendum to DIN EN 61076-3-101:1998-05; (IEC-Cor. :2010 to IEC 61076-3-101:1997)
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2012); German version EN 60352-5:2012.
€122.34
