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DIN EN 60749-19:2011-01
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010.
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Summary
This part of DIN EN 60749 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This new release of the standard covers an additional NOTE in the scope.
Notes
DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2011 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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