Superseded
Standard
Historical
DIN EN 60749-20:2010-04
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009.
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Summary
This test method provides a means of assessing the resistance to soldering heat of plastic encapsulated surface mount devices (SMDs). This test is destructive.
Notes
DIN EN 60749-20 (2003-12) remains valid alongside this standard until 2012-09-01.*A transition period, as set out in DIN EN IEC 60749-20 (2023-07), exists until 2023-10-05.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 04/01/2010 |
| Page Count | 28 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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