Superseded
Draft standard
Historical
DIN EN 60749-3:2017-05
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 47/2345/FDIS:2016); German version FprEN 60749-3:2016
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Summary
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance, or both.
Notes
Prévu pour remplacer DIN EN 60749-3 (2003-04).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 05/01/2017 |
| Cancellation Date | 01/01/2018 |
| Page Count | 19 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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