IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
€244.00
IEC 60191-2:1966/AMD12:2006 Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€23.00
IEC 60191-2:1966/AMD13:2006 Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€93.00
IEC 60191-2:1966/AMD14:2006 Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€46.00
IEC 60191-2:1966/AMD15:2006 Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
€186.00
IEC 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60191-2:1966/AMD16:2007 Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60747-9:2007 Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs)
€389.00
IEC 60747-5-5:2007 Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
€133.00
IEC 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
IEC 60191-2:1966/AMD17:2008 Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
