IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
€93.00
IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
IEC 60749-1:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General
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IEC 60749-2:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-8:2002/COR2:2003 Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
€0.00
IEC 60749-10:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-11:2002/COR2:2003 Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
IEC 60749-22:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-31:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-32:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60191-2:1966/AMD9:2003 Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€23.00
IEC 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
€46.00
IEC 60191-2:1966/AMD10:2004 Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD11:2004 Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
