IEC 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
€133.00
IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
€186.00
IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 60191-6-19:2010 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
€93.00
IEC 62418:2010 Semiconductor devices - Metallization stress void test
IEC 60747-1:2006/AMD1:2010 Amendment 1 - Semiconductor devices - Part 1: General
€12.00
IEC 62415:2010 Semiconductor devices - Constant current electromigration test
€46.00
IEC 60191-6-18:2010/COR1:2010 Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
This product is not for sale, please contact us for more information
IEC 62615:2010 Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level
IEC 60191-6-18:2010/COR2:2010 Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60749-19:2003/AMD1:2010 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60749-32:2002/AMD1:2010 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
€23.00
