IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
€389.00
IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2: Dimensions
€551.00
IEC 60796-1:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 1: Functional description with electrical and timing specifications
IEC 60796-2:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 2: Mechanical and pin descriptions for the system BUS configuration, with edge connectors (direct)
€46.00
IEC 60796-3:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 3: Mechanical and pin descriptions for the Eurocard configuration with pin and socket (indirect) connectors
IEC 60191-2T:1996 Eighteenth supplement
€12.00
IEC 60191-5:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
€302.00
IEC 60191-2V:1998 Twentieth supplement
IEC 60191-2W:1999 Twenty-first supplement
€93.00
IEC 60191-2X:1999 Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
IEC 60191-2X:1999/COR1:2000 Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
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IEC 60191-2Y:2000 Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€186.00
IEC 60191-2Z:2000 Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€23.00
IEC 60191-2:1966/AMD1:2001 Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
