Electronic equipment obsolescence - Guide applied obsolescence management - Obsolescence des équipements électroniques
€126.00
Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (SFBGA and S-FLGA)
€95.67
Semiconductor devices - Mechanical and climatic test methods - Part 28 : Electrostatic Discharge (ESD) Sensitivity Testing - Direct contact charged device model (DC-CDM)
€158.33
Semiconductor devices - Mechanical and climatic test methods - Part 42 : temperature humidity storage - Dispositifs à semiconducteurs
€77.67
Semiconductor devices - Mechanical and climatic test methods - Part 40 : board level drop test method using a strain gauge - Dispositifs à semiconducteurs
€111.67
Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling - Dispositifs à semiconducteurs
Mechanical standardization of semiconductor devices - Part 6-12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
€87.39
Semiconductor devices - Mechanical and climatic test methods - Part 29 : latch-up test - Dispositifs à semiconducteurs
€93.67
Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
€99.97
Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
€107.00
Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
€59.00
Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
€50.00
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
€53.00
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
€58.00
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
€35.00
