Superseded
Standard
Historical
DIN EN 61190-1-2:2007-11
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007.
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Summary
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
Notes
DIN EN 61190-1-2 (2003-01) remains valid alongside this standard until 2010-05-01.*A transition period, as set out in DIN EN 61190-1-2 (2014-11), exists until 2017-03-26.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 11/01/2007 |
| Cancellation Date | 11/01/2014 |
| Page Count | 22 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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