Superseded
Draft amendment
Historical
DIN EN 61190-1-2/A1:2012-03
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)
Preview
Summary
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
Notes
Prévu comme amendement à DIN EN 61190-1-2 (2007-11).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 03/01/2012 |
| Cancellation Date | 11/01/2014 |
| Page Count | 23 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
01/11/2007
Superseded
Historical
