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DIN EN 61190-1-2:2014-11
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014.
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Summary
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
Notes
DIN EN 61190-1-2 (2007-11) remains valid alongside this standard until 2017-03-26.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 11/01/2014 |
| Page Count | 24 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Previous versions
01/11/2007
Superseded
Historical
