29.045 : Semiconducting materials

PD IEC TR 60146-1-2:2019

PD IEC TR 60146-1-2:2019

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Semiconductor converters. General requirements and line commutated converters Application guide

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DIN 50450-2:2025-07

DIN 50450-2:2025-07

Superseded Historical

Testing of materials for semiconductor technology - Determination of impurities in carrier gases and dopant gases - Part 2: Determination of Oxygen impurities in Nitrogen, Argon, Helium, Neon and Hydrogen using a galvanic cell

€48.79

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DIN 50450-2:2026-03

DIN 50450-2:2026-03

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Testing of materials for semiconductor technology - Determination of impurities in carrier gases and dopant gases - Part 2: Determination of Oxygen impurities in Nitrogen, Argon, Helium, Neon and Hydrogen using a galvanic cell

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ASTM F1618-02

ASTM F1618-02

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Standard Practice for Determination of Uniformity of Thin Films on Silicon Wafers (Withdrawn 2003)

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ASTM F1527-02

ASTM F1527-02

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Standard Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon (Withdrawn 2003)

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ASTM F28-02

ASTM F28-02

Withdrawn Most Recent

Standard Test Methods for Minority-Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay (Withdrawn 2003)

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ASTM F84-02

ASTM F84-02

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Standard Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe (Withdrawn 2003)

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ASTM F374-02

ASTM F374-02

Withdrawn Most Recent

Standard Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure (Withdrawn 2003)

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ASTM F391-02

ASTM F391-02

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Standard Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-State Surface Photovoltage (Withdrawn 2003)

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ASTM F397-02

ASTM F397-02

Withdrawn Most Recent

Standard Test Method for Resistivity of Silicon Bars Using a Two-Point Probe (Withdrawn 2003)

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ASTM F523-02

ASTM F523-02

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Standard Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces (Withdrawn 2003)

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ASTM F533-02a

ASTM F533-02a

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Standard Test Method for Thickness and Thickness Variation of Silicon Wafers (Withdrawn 2003)

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ASTM F534-02a

ASTM F534-02a

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Standard Test Method for Bow of Silicon Wafers (Withdrawn 2003)

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ASTM F847-02

ASTM F847-02

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Standard Test Methods for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques (Withdrawn 2003)

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ASTM F950-02

ASTM F950-02

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Standard Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Slice Surface by Angle Polishing and Defect Etching (Withdrawn 2003)

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