31.080.01 : Semiconductor devices in general

IEC 60821:1991

IEC 60821:1991

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IEC 60821:1991 VMEbus - Microprocessor system bus for 1 byte to 4 byte data

€551.00

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IEC 60191-2U:1997

IEC 60191-2U:1997

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IEC 60191-2U:1997 Nineteenth supplement

€23.00

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IEC 60749-13:2018

IEC 60749-13:2018

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IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

€93.00

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IEC 60191-4:2013/AMD1:2018

IEC 60191-4:2013/AMD1:2018

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IEC 60191-4:2013/AMD1:2018 Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

€93.00

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IEC 60749-22-1:2025

IEC 60749-22-1:2025

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IEC 60749-22-1:2025 Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods

€441.00

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IEC 60749-7:2025

IEC 60749-7:2025

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IEC 60749-7:2025 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

€93.00

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IEC 60749-22-2:2025

IEC 60749-22-2:2025

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IEC 60749-22-2:2025 Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods

€302.00

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NF C03-205 (04/1985)

NF C03-205 (04/1985)

Superseded Historical

Graphical symbols for diagrams. Part 5 : semiconductors and electron tubes.

€96.00

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NF C96-315 (07/1987)

NF C96-315 (07/1987)

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Microstructures - Microélectronique hyperfréquence - Microélectronique hyperfréquence et dispositifs relevant des mêmes prescriptions - Atténuateurs et charges.

€145.67

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PR NF EN IEC 63378-6-1 (11/2025)

PR NF EN IEC 63378-6-1 (11/2025)

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Normalisation thermique des boîtiers de semiconducteurs - Partie 6-1: Modèle de résistance thermique et de capacité pour la prédiction de la température transitoire aux points de jonction et de mesure - Méthode de création de modèle utilisant une fiche te

€61.00

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PR NF EN IEC 63378-6, C86-378-6PR (07/2025)

PR NF EN IEC 63378-6, C86-378-6PR (07/2025)

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Normalisation thermique des boîtiers de semiconducteurs - Partie 6 : Modèle de résistance thermique et de capacité pour la prédiction de la température transitoire aux points de jonction et de mesure

€116.50

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PR NF EN IEC 63287-4, C96-287-4PR (08/2025)

PR NF EN IEC 63287-4, C96-287-4PR (08/2025)

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Dispositifs à semiconducteurs - Lignes directrices concernant les plans de qualification de la fiabilité - Partie 4 : évaluation des défaillances précoces

€70.00

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IEEE 1804:2017

IEEE 1804:2017

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IEEE Standard for Fault Accounting and Coverage Reporting(FACR) for Digital Modules

€55.00

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DIN EN IEC 60749-15:2019-12

DIN EN IEC 60749-15:2019-12

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2575/CDV:2019); German and English version prEN IEC 60749-15:2019

€63.27

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DIN EN IEC 60749-18:2020-02

DIN EN IEC 60749-18:2020-02

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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2019); German version EN IEC 60749-18:2019.

€111.40

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