Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011
€98.32
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010.
€77.20
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010); German version EN 60749-15:2010 + AC:2011.
€63.27
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009
€128.22
Fixed resistors for use in electronic equipment - Part 2: Sectional specification - Fixed low-power non-wirewound resistors (IEC 40/2013/CD:2009)
€140.00
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009.
€111.40
Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
Semiconductor devices - Metallization stress void test (IEC 62418:2010); German version EN 62418:2010
IEC 63378-3:2025 Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
€93.00
IEC 60749-34-1:2025 Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
€244.00
IEC 62007-2:2025 Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
€342.00
Dispositifs à semiconducteurs - Lignes directrices génériques concernant la qualification des semiconducteurs - Partie 3 : Lignes directrices pour les plans de qualification de la fiabilité des modules à semiconducteurs de puissance
€116.50
IEC 60822:1988 VSB - Parallel Sub-system Bus of the IEC 60821 VMEbus
€499.00
IEC TR 60828:1988 Pin allocations for microprocessor systems using the IEC 60603-2 connector
€12.00
