Microstructures - Microélectronique hyperfréquence - Mélangeurs de réception - Recueil de feuilles particulières.
€59.33
SEMICONDUCTOR DEVICES. MECHANICAL AND CLIMATIC TEST METHODS.
€71.00
Electronic components - Long-term storage of electronic semiconductor devices - Part 1 : general
€102.58
Normalisation thermique des boîtiers de semiconducteurs - Partie 3 : modèles de simulation de circuits thermiques de boîtiers de semiconducteurs discrets pour analyse transitoire
€95.67
Dispositifs hyperfréquences - Procédures d'agrément de savoir-faire pour les dispositifs hyperfréquences - Prescriptions provisoires
€106.33
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014)
€105.42
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013)
€116.64
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 47F/177/CD:2013)
€128.22
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plan (IEC 47/2169/CD:2013)
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
€91.03
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 47/2193/CD:2014)
Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
€98.32
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)
