IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
€302.00
IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
€186.00
IEC 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
€46.00
IEC 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
€244.00
IEC 62047-10:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
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IEC 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
€93.00
IEC 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
€133.00
IEC 62047-9:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 62047-5:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
IEC 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
€342.00
IEC 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 62047-11:2013 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
IEC 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
