31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
25/30511310 DC:2025

25/30511310 DC:2025

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Draft BS EN 62047-56 Micro-electromechanical devices Part 56. Test method for characteristics of MEMS metal oxide semiconductor (MOS) type gas sensor

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BS EN IEC 60749-34-1:2025

BS EN IEC 60749-34-1:2025

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Semiconductor devices. Mechanical and climatic test methods Power cycling for power semiconductor module

€316.00

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25/30510635 DC:2025

25/30510635 DC:2025

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Draft BS EN 63567-3 Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment Part 3: Nano-scale wafer surface method using UV light

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25/30511332 DC:2025

25/30511332 DC:2025

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Draft BS EN 60747-17 Ed.2.0 Semiconductor devices Part 17: Magnetic and capacitive coupler for basic reinforced insulation

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25/30531414 DC:2025

25/30531414 DC:2025

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BS IEC 63672 Guidelines for evaluating DV/DT robustness of SIC power devices

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25/30531418 DC:2025

25/30531418 DC:2025

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BS IEC 63673 Guidelines for Gate Charge (QG) test method for SIC MOSFET

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BS EN IEC 62007-2:2025

BS EN IEC 62007-2:2025

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Semiconductor optoelectronic devices for fibre optic system applications Measuring methods

€355.00

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BS IEC 60747-2:2025

BS IEC 60747-2:2025

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Semiconductor devices Discrete devices. Rectifier diodes

€374.00

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BS IEC 60747-6:2025

BS IEC 60747-6:2025

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Semiconductor devices Discrete devices. Thyristors

€404.00

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BS IEC 62047-53:2025

BS IEC 62047-53:2025

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Semiconductor devices. Micro-electromechanical devices MEMS electrothermal transfer device

€193.00

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25/30510059 DC:2025

25/30510059 DC:2025

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BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages Part 2-2: 3D thermal simulation models of for steady-state analysis - PBGA and FBGA

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25/30508761 DC:2025

25/30508761 DC:2025

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BS EN IEC 60747-5-13/AMD1 Amendment 1 - Semiconductor devices Part 5-13: Optoelectronic Hydrogen sulphide corrosion test for LED packages

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25/30510337 DC:2025

25/30510337 DC:2025

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Draft BS EN 63378-4 Thermal standardization on semiconductor packages Part 4. evaluation board specifications for fine pitch

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25/30513132 DC:2025

25/30513132 DC:2025

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BS EN IEC 63068-5 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power Part 5: Test method using X-ray topography

€23.00

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25/30513804 DC:2025

25/30513804 DC:2025

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Draft BS IEC 63581-1 Semiconductor devices. The recognition criteria of defects in polished indium phosphide wafers Part 1. Classification

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