Normadoc

NF EN 62007-1, C93-801-1 (10/2015)

Active Most Recent

Semiconductor optoelectronic devices for fibre optic system applications - Part 1 : specification template for essential ratings and characteristics

€107.86

NF EN 60191-4, C96-013-4 (09/2000)

Superseded Historical

Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages

€96.59

NF EN 62258-6, C96-034-6 (12/2006)

Active Most Recent

Semiconductor die products - Part 6 : requirements for information concerning thermal simulation

€62.50

NF EN 60749-39, C96-022-39 (12/2006)

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components - Dispositifs à semiconducteurs

€59.33

NF EN 60749-37, C96-022-37 (07/2008)

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 37 : board level drop test method using an accelerometer - Dispositifs à semiconducteurs

€106.33

NF EN 60749-38, C96-022-38 (06/2008)

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 38 : soft error test method for semiconductor devices with memory - Dispositifs à semiconducteurs

€95.67

NF EN 62007-2, C93-801-2 (09/2009)

Active Most Recent

Semiconductor optoelectronic devices for fibre optic system applications - Part 2 : measuring methods

€107.86

NF EN 60749-20, C96-022-20 (02/2010)

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Dispositifs à semiconducteurs

€106.33

NF EN 60749-20-1, C96-022-20-1 (07/2009)

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 20-1 : handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat - Dispositifs à semiconducteurs

€126.00

NF EN 60191-6-3, C96-013-6-3 (04/2001)

Active Most Recent

Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

€86.33

NF EN 60749-2, C96-022-2 (12/2002)

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 2 : low air pressure - Dispositifs à semiconducteurs

€59.33

NF EN 60749-10, C96-022-10 (12/2002)

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 10 : mechanical shock - Dispositifs à semiconducteurs

€56.33

NF EN 60749-11, C96-022-11 (12/2002)

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 11 : rapid change of temperature - Two-fluid-bath method - Dispositifs à semiconducteurs

€59.33

NF EN 60191-4/A1, C96-013-4/A1 (05/2002)

Superseded Historical

Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages

€54.50

NF EN 60749-1, C96-022-1 (11/2003)

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 1 : general - Dispositifs à semiconducteurs

€59.33

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31.080.01 : Semiconductor devices in general

NF EN 62007-1, C93-801-1 (10/2015)

NF EN 60191-4, C96-013-4 (09/2000)

NF EN 62258-6, C96-034-6 (12/2006)

NF EN 60749-39, C96-022-39 (12/2006)

NF EN 60749-37, C96-022-37 (07/2008)

NF EN 60749-38, C96-022-38 (06/2008)

NF EN 62007-2, C93-801-2 (09/2009)

NF EN 60749-20, C96-022-20 (02/2010)

NF EN 60749-20-1, C96-022-20-1 (07/2009)

NF EN 60191-6-3, C96-013-6-3 (04/2001)

NF EN 60749-2, C96-022-2 (12/2002)

NF EN 60749-10, C96-022-10 (12/2002)

NF EN 60749-11, C96-022-11 (12/2002)

NF EN 60191-4/A1, C96-013-4/A1 (05/2002)

NF EN 60749-1, C96-022-1 (11/2003)