Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
€111.67
Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
€77.67
Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures
€93.67
IEC 822 VSB. Parallel sub-system bus of the IEC 821 VMEBUS.
€252.67
SEMICONDUCTOR DEVICES. PART 11: SECTIONAL SPECIFICATION FOR DISCRETE DEVICES.
€61.00
IEC 822 VSB. PARALLEL SUB-SYSTEM BUS OF THE IEC 821 VMEBUS.
€157.00
Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
€101.00
Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
€153.00
Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
€125.00
Semiconductor devices - Part 16-6 : microwave integrated circuits - Frequency multipliers
€116.50
Semiconductor devices - Part 17 : magnetic and capacitive coupler for basic and reinforced insulation
€166.33
Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
€98.42
Semiconductor devices - Micro-electromechanical devices - Part 17 : bulge test method for measuring mechanical properties of thin films - Dispositifs à semiconducteurs
€126.00
Semiconductor devices - Part 16-5 : microwave integrated circuits - Oscillators
€59.33