29.045 : Semiconducting materials

DIN 50450-9:2021-07

DIN 50450-9:2021-07

Active Most Recent

Testing of materials for semiconductor technology - Determination of impurities in carrier gases and dopant gases - Part 9: Determination of oxygen, nitrogen, carbonmonoxide, carbondioxide, hydrogen and C-C-hydrocarbons in gaseous hydrogen chloride by gaschromatography

€41.78

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DIN 50451-8:2022-01

DIN 50451-8:2022-01

Superseded Historical

Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 8: Determination of 33 elements in high-purity sulfuric acid by ICP-MS

€56.17

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DIN 50451-5:2022-02

DIN 50451-5:2022-02

Superseded Historical

Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 5: Guideline for the selection of materials and testing of their suitability for apparatus for sampling and sample preparation for the determination of trace elements in the range of micrograms per kilogram and nanograms per kilogram

€56.17

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DIN 50451-4:2024-01

DIN 50451-4:2024-01

Superseded Historical

Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 4: Determination of 34 elements in ultra pure water by mass spectrometry with inductively coupled plasma (ICP-MS)

€69.91

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DIN 1715-1:1983-11

DIN 1715-1:1983-11

Withdrawn Most Recent

Thermostat metals; technical delivery conditions

€48.79

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DIN 1715-2:1983-11

DIN 1715-2:1983-11

Withdrawn Most Recent

Thermostat metals; testing the specific thermal curvature

€34.30

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DIN 50450-9:2020-11

DIN 50450-9:2020-11

Superseded Historical

Testing of materials for semiconductor technology - Determination of impurities in carrier gases and dopant gases - Part 9: Determination of oxygen, nitrogen, carbonmonoxide, carbondioxide, hydrogen and C-C-hydrocarbons in gaseous hydrogen chloride by gaschromatography

€41.78

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ASTM F80-94

ASTM F80-94

Withdrawn Most Recent

Test Method for Crystallographic Perfection of Epitaxial Deposits of Silicon by Etching Techniques (Withdrawn 1998)

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ASTM F416-94

ASTM F416-94

Withdrawn Most Recent

Test Method for Detection of Oxidation Induced Defects in Polished Silicon Wafers (Withdrawn 1998)

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ASTM F522-94

ASTM F522-94

Withdrawn Most Recent

Test Method for Stacking Fault Density of Epitaxial Layers of Silicon by Interference-Contrast Microscopy (Withdrawn 1998)

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ASTM F35-68(1988)

ASTM F35-68(1988)

Withdrawn Most Recent

Practice for Identification of Minute Crystalline Particle Contaminants by X-Ray Diffraction (Withdrawn 1994)

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ASTM F40-83

ASTM F40-83

Withdrawn Most Recent

Method for Preparing Monocrystalline Test Ingots of Silicon by the Vertical-Pulling (Czochralski) Technique (Withdrawn 1988)

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ASTM F41-90

ASTM F41-90

Withdrawn Most Recent

Practice for Preparing Silicon Single Crystals by the Floating-Zone Technique for Evaluation of Polysilicon Ingot (Withdrawn 1996)

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ASTM F121-83

ASTM F121-83

Superseded Historical

Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption

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ASTM F122-74(1985)

ASTM F122-74(1985)

Withdrawn Most Recent

Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption (Withdrawn 1990)

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