Thermal standardization on semiconductor packages resistance and thermal parameter of BGA, QFP type
€269.00
Semiconductor devices. Mechanical and climatic test methods shock. device subassembly
€193.00
BS EN 60601-2-93 Medical electrical equipment Part 2-93: Particular requirements for the basic safety and essential performance of neutron capture therapy
€23.00
BS EN IEC 63068-5 Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Part 5. Test method using X-ray topography
IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
€93.00
BS EN 63378-3. Thermal standardization on semiconductor packages Part 3. circuit simulation models of for transient analysis
BS EN 60749-34-1. Semiconductor devices. Mechanical and climatic test methods Part 34-1. Power cycling for power semiconductor module
Semiconductor optoelectronic devices for fibre optic system applications Specification template essential ratings and characteristics
€316.00
BS EN 63150-3 Ed.1.0. Semiconductor devices. Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment Part 3. Human foot impact motion
Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life
BS EN IEC 63378-3. Thermal standardization on semiconductor packages Part 3. circuit simulation models of discrete for transient analysis
BS EN 60747-16-11 Semiconductor devices Part 16-11. Microwave integrated circuits - Power detectors
BS IEC 60747-5-4 AMD 1. Semiconductor devices Part 5-4. Optoelectronic devices. lasers
BS EN IEC 62007-2. Semiconductor optoelectronic devices for fibre optic system applications Part 2. Measuring methods
BS EN IEC 63287-3. Semiconductor devices. Generic semiconductor qualification guidelines Part 3. Guidelines for reliability plans power module
