Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
€269.00
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
€165.00
Semiconductor devices. Discrete devices Optoelectronic lasers
Semiconductor devices. Discrete devices Insulated-gate bipolar transistors (IGBTs)
€374.00
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide ball grid array (BGA)
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
Semiconductor devices Generic specification for discrete and integrated circuits
€316.00
Semiconductor devices Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
€193.00
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide packages Silicon Fine-pitch Ball Grid Array and Land (S-FBGA S-FLGA)
BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods Part 20-1. Handling, packing, labelling shipping of surface-mount devices sensitive to the combined effect moisture soldering heat
€23.00
Semiconductor devices Smart sensors. Control scheme of smart sensors
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method using photoluminescence
BS EN IEC 62047-37. Semiconductor devices. Micro-electromechanical devices Part 37. Environmental test methods of MEMS piezoelectric thin films for sensor application
Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
