Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions ball grid array (BGA)
€193.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide gull-wing lead terminals
€165.00
Data requirements for semiconductor die. Particular and recommendations die types Minimally-packaged
Semiconductor devices. Mechanical and climatic test methods Low air pressure
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Semiconductor devices. Mechanical and climatic test methods Temperature cycling
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased autoclave
Semiconductor devices. Mechanical and climatic test methods Sealing
Semiconductor devices. Mechanical and climatic test methods Bond strength
€269.00
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) integrated circuits
€316.00
Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval)
Environmental testing. Test methods Body strength and impact shock
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
€404.00
Specification for binary floating point arithmetic for microprocessor systems
