Semiconductor devices. Mechanical and climatic test methods Board level drop method using a strain gauge
€269.00
Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
Environmental testing. Test methods Tests. M. Low air pressure
€165.00
Discrete semiconductor devices and integrated circuits. Semiconductor devices. sensors Hall elements
€193.00
Data requirements for semiconductor die. Particular and recommendations die types Bare with added connection structures
Data requirements for semiconductor die. Particular and recommendations die types Bare
Data requirements for semiconductor die. Specific and recommendations Test quality
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide glass sealed ceramic quad flatpack (G-QFP)
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings integrated circuits
€374.00
Data requirements for semiconductor die. Exchange data formats and dictionary
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions quad flat packs (QFP)
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine pitch land grid array (FLGA) Proposed amendment on terminology
Semiconductor devices. Mechanical and climatic test methods General
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitchball grid array (FBGA)
Semiconductor devices. Mechanical and climatic test methods Acceleration, steady state
