Semiconductor devices. Stress migration test standard Copper stress
€269.00
Semiconductor devices. Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) method for semiconductor devices
Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
€316.00
Mechanical standardization of semiconductor devices Design guideline open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Land (FLGA)
BS EN 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
€23.00
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
€193.00
Semiconductor devices. interface for human body communication General requirements
Semiconductor devices. interface for human body communication Characterization of interfacing performances
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
€374.00
Semiconductor devices. Mechanical and climatic test methods Temperature humidity storage
€165.00
Mechanical standardization of semiconductor devices Dimensions
€404.00
Semiconductor devices. Micro-electromechanical devices Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress (HAST)
Semiconductor devices Discrete devices. Insulated-gate bipolar transistors (IGBTs)
Semiconductor devices. Mechanical and climatic test methods Storage at high temperature
