Dispositifs à semiconducteurs - Lignes directrices génériques concernant la qualification des semiconducteurs - Partie 3 : Lignes directrices pour les plans de qualification de la fiabilité des modules à semiconducteurs de puissance
€116.50
IEC 60822:1988 VSB - Parallel Sub-system Bus of the IEC 60821 VMEbus
€499.00
IEC TR 60828:1988 Pin allocations for microprocessor systems using the IEC 60603-2 connector
€12.00
IEC 60821:1991 VMEbus - Microprocessor system bus for 1 byte to 4 byte data
€551.00
IEC 60191-2U:1997 Nineteenth supplement
€23.00
IEC 60747-4:2007/AMD1:2017 Amendment 1 - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
€186.00
IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
€93.00
IEC 62031:2018 LED modules for general lighting - Safety specifications
IEC 60191-4:2013/AMD1:2018 Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60749-22-1:2025 Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
€441.00
IEC 60749-7:2025 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
IEC 60749-22-2:2025 Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
€302.00
Graphical symbols for diagrams. Part 5 : semiconductors and electron tubes.
€96.00
Microstructures - Microélectronique hyperfréquence - Microélectronique hyperfréquence et dispositifs relevant des mêmes prescriptions - Atténuateurs et charges.
€145.67
