31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
DIN EN 60749-43:2013-10

DIN EN 60749-43:2013-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plan (IEC 47/2169/CD:2013)

€128.22

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DIN EN 60747-16-5:2014-04

DIN EN 60747-16-5:2014-04

Superseded Historical

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013); German version EN 60747-16-5:2013.

€140.00

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DIN EN 62047-11:2014-04

DIN EN 62047-11:2014-04

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013

€105.42

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DIN EN 62047-18:2014-04

DIN EN 62047-18:2014-04

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013

€91.03

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DIN EN 60749-44:2014-08

DIN EN 60749-44:2014-08

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 47/2193/CD:2014)

€105.42

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DIN EN 62880-1:2014-08

DIN EN 62880-1:2014-08

Withdrawn Most Recent

Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)

€128.22

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DIN EN 62830-3:2014-09

DIN EN 62830-3:2014-09

Withdrawn Most Recent

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting (IEC 47/2198/CD:2014)

€105.42

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DIN EN 62047-6:2010-07

DIN EN 62047-6:2010-07

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010

€98.32

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DIN IEC 62047-11:2010-06

DIN IEC 62047-11:2010-06

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)

€91.03

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DIN EN 62374-1:2011-06

DIN EN 62374-1:2011-06

Active Most Recent

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011

€98.32

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DIN EN 60749-34:2011-05

DIN EN 60749-34:2011-05

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010.

€77.20

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DIN EN 60749-15:2011-06

DIN EN 60749-15:2011-06

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010); German version EN 60749-15:2010 + AC:2011.

€63.27

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DIN EN 60749-23:2011-07

DIN EN 60749-23:2011-07

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011.

€77.20

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DIN EN 60747-16-4:2011-08

DIN EN 60747-16-4:2011-08

Superseded Historical

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009); German version EN 60747-16-4:2004 + A1:2011.

€116.64

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DIN IEC 60747-16-5:2009-03

DIN IEC 60747-16-5:2009-03

Superseded Historical

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 47E/374/CD:2008)

€134.02

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