DIN EN 62951-1:2015-06

DIN EN 62951-1:2015-06

Withdrawn Most Recent

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates (IEC 47/2224/CD:2015)

€84.58

View more
DIN EN 62047-27:2015-08

DIN EN 62047-27:2015-08

Withdrawn Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/216/CD:2015)

€91.03

View more
DIN EN 62047-16:2015-12

DIN EN 62047-16:2015-12

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015

€84.58

View more
DIN EN 62047-17:2015-12

DIN EN 62047-17:2015-12

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015

€111.40

View more
DIN EN 62047-15:2016-01

DIN EN 62047-15:2016-01

Withdrawn Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015); German version EN 62047-15:2015

€84.58

View more
DIN EN 62047-29:2016-08

DIN EN 62047-29:2016-08

Withdrawn Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature (IEC 47F/243/CD:2016)

€69.91

View more
DIN EN 62047-30:2016-08

DIN EN 62047-30:2016-08

Withdrawn Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film (IEC 47F/241/CD:2016)

€105.42

View more
DIN EN 62047-26:2016-12

DIN EN 62047-26:2016-12

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016

€116.64

View more
DIN EN 62047-1:2016-12

DIN EN 62047-1:2016-12

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016.

€128.22

View more
DIN EN 62047-25:2017-04

DIN EN 62047-25:2017-04

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016

€105.42

View more
IEC 60512-23-3:2000/COR1:2003

IEC 60512-23-3:2000/COR1:2003

Superseded Historical

IEC 60512-23-3:2000/COR1:2003 Corrigendum 1 - Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories

€0.00

View more
IEC 60050-581:2008

IEC 60050-581:2008

Active Most Recent

IEC 60050-581:2008 International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment

€441.00

View more
IEC 60512-9-1:2010

IEC 60512-9-1:2010

Active Most Recent

IEC 60512-9-1:2010 Connectors for electronic equipment - Tests and measurements - Part 9-1: Endurance tests - Test 9a: Mechanical operation

€23.00

View more
IEC 60512-7-1:2010

IEC 60512-7-1:2010

Active Most Recent

IEC 60512-7-1:2010 Connectors for electronic equipment - Tests and measurements - Part 7-1: Impact tests (free connectors) - Test 7a: Free fall (repeated)

€23.00

View more
IEC 60512-9-5:2010

IEC 60512-9-5:2010

Superseded Historical

IEC 60512-9-5:2010 Connectors for electronic equipment - Tests and measurements - Part 9-5: Endurance tests - Test 9e: Current loading, cyclic

€23.00

View more