UNE-EN 60512-11-14:1999

UNE-EN 60512-11-14:1999

Superseded Historical

ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT - BASIC TESTING PROCEDURES AND MEASURING METHODS. PART 11: CLIMATIC TESTS. SECTION 14: TEST 11P. FLOWING SINGLE GAS CORROSION TEST.

€47.00

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UNE-EN 60512-13-1:1998

UNE-EN 60512-13-1:1998

Superseded Historical

ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT. BASIC TESTING PROCEDURES AND MEASURING METHODS. PART 13: MECHANICAL OPERATING TESTS. SECTION 1: TEST 13A: ENGAGING AND SEPARATING FORCES.

€26.00

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DIN EN 62047-25:2014-05

DIN EN 62047-25:2014-05

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014)

€105.42

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DIN EN 62047-26:2014-05

DIN EN 62047-26:2014-05

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013)

€116.64

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DIN EN 62047-1:2014-05

DIN EN 62047-1:2014-05

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 47F/177/CD:2013)

€128.22

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DIN EN 62047-11:2014-04

DIN EN 62047-11:2014-04

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Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013

€105.42

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DIN EN 62047-18:2014-04

DIN EN 62047-18:2014-04

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Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013

€91.03

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DIN EN 62047-19:2014-04

DIN EN 62047-19:2014-04

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Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013

€116.64

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DIN EN 62047-6:2010-07

DIN EN 62047-6:2010-07

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Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010

€98.32

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DIN IEC 62047-11:2010-06

DIN IEC 62047-11:2010-06

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)

€91.03

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NF C01-581 (06/1982)

NF C01-581 (06/1982)

Withdrawn Most Recent

Vocabulaire électrotechnique - Chapitre 581 : composants électromécaniques pour équipements électroniques (changement de statut de NF C 01-581, juillet 1980, ENR.).

€120.00

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IEC 60512-1-4:1997

IEC 60512-1-4:1997

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IEC 60512-1-4:1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof)

€23.00

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IEC 60512-14-7:1997

IEC 60512-14-7:1997

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IEC 60512-14-7:1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 14: Sealing tests - Section 7: Test 14g: Impacting water

€12.00

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NF EN 60512-1-4, C93-400-1-4 (02/1998)

NF EN 60512-1-4, C93-400-1-4 (02/1998)

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Composants électromécaniques pour équipements électroniques - Procédures d'essai de base et méthodes de mesure - Partie 1 : généralités. Section 4 : essai 1d : efficacité de la protection des contacts (scoop-proof)

€58.00

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PR NF EN 50625-1 (12/2025)

PR NF EN 50625-1 (12/2025)

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Exigences de collecte, logistique et traitement pour les déchets d’équipements électriques et électroniques (DEEE) - Partie 1 : Exigences générales du traitement

€87.00

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