Electrostatic Discharge Sensitivity Testing - Transmission Line Pulse (TLP) - Component Level (IEC 47/2006/CDV:2008)
€105.42
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 47/2012/CD:2009)
€111.40
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
€63.27
Semiconductor devices - Part 1: General (IEC 47/2015A/CDV:2009)
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 47/2018/CDV:2009); German version EN 60749-32:2003/FprA1:2009
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/2017/CDV:2009); German version EN 60749-23:2004/FprA1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2019/CDV:2009); German version EN 60749-30:2005/FprA1:2009
€48.79
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2021/CDV:2009); German version FprEN 60749-7:2009
€69.91
Semiconductor die products - Part 2: Exchange data formats (IEC 47/2023/CDV:2009); English version FprEN 62258-2:2009
€185.05
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 47/2027/CDV:2009); German version FprEN 60749-34:2009
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 47/2026/CDV:2009); German version FprEN 60749-29:2009
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000); German version EN 60749:1999 + A1:2000.
€140.00
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001.
€162.06
