31.080.01 : Semiconductor devices in general

DIN IEC 62047-6:2007-07

DIN IEC 62047-6:2007-07

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 47/1900/CD:2007)

€91.03

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DIN EN 60749-20:2007-10

DIN EN 60749-20:2007-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007

€105.42

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DIN IEC 62047-5:2008-02

DIN IEC 62047-5:2008-02

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS Switches (IEC 47/1928/CD:2007)

€116.64

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DIN IEC 62374-1:2008-02

DIN IEC 62374-1:2008-02

Superseded Historical

Time Dependent Dielectric Breakdown Test (TDDB) for Inter-metal layers (IEC 47/1946/CD:2007)

€91.03

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DIN IEC 62047-9:2008-03

DIN IEC 62047-9:2008-03

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)

€98.32

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DIN EN 60749-19:2003-10

DIN EN 60749-19:2003-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003); German version EN 60749-19:2003 + Corrigendum 2003-06.

€41.78

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DIN EN 60749-15:2003-10

DIN EN 60749-15:2003-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2003); German version EN 60749-15:2003.

€56.17

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DIN EN 60749-20:2003-12

DIN EN 60749-20:2003-12

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003.

€98.32

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DIN EN 60749-32:2003-12

DIN EN 60749-32:2003-12

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2003 + Corr. 1:2003); German version EN 60749-32:2003 + Corr.:2003.

€41.78

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DIN IEC 62047-1:2003-10

DIN IEC 62047-1:2003-10

Superseded Historical

Semiconductor devices - Part 1: Microelectromechanical devices; Terms and definitions (IEC 47/1695A/CD:2003)

€98.32

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DIN IEC 60747-1:2004-06

DIN IEC 60747-1:2004-06

Withdrawn Most Recent

Semiconductor devices - Part 1: General (IEC 47/1734/CD:2003)

€122.34

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DIN EN 60749-29:2004-07

DIN EN 60749-29:2004-07

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 60749-29:2003); German version EN 60749-29:2003 + Corrigendum:2004.

€98.32

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DIN EN IEC 63364-1:2025-01

DIN EN IEC 63364-1:2025-01

Active Most Recent

Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection (IEC 63364-1:2022); German version EN IEC 63364-1:2023

€84.58

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DIN 45930-1019*CECC 50006:1983-05

DIN 45930-1019*CECC 50006:1983-05

Superseded Historical

Harmonized system of quality assessment for electronic components; blank detail specification: variable capacitance diode(s)

€48.79

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DIN IEC 47(CO)894:1983-08

DIN IEC 47(CO)894:1983-08

Withdrawn Most Recent

Amendments to the generic specification for semiconductor devices and integrated circuits; sampling requirements for small lots

€34.30

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