IEC 60749-31:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
This product is not for sale, please contact us for more information
IEC 60749-32:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60191-2:1966/AMD9:2003 Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€23.00
IEC 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
€46.00
IEC 60191-2:1966/AMD10:2004 Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD11:2004 Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
€93.00
IEC 61967-2:2005 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
€186.00
IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
€244.00
IEC 60191-2:1966/AMD12:2006 Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD13:2006 Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD14:2006 Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD15:2006 Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 62373:2006 Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
