31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
IEC 60191-6-18:2010/COR1:2010

IEC 60191-6-18:2010/COR1:2010

Active Most Recent

IEC 60191-6-18:2010/COR1:2010 Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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IEC 62615:2010

IEC 62615:2010

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IEC 62615:2010 Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level

€133.00

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IEC 60191-6-18:2010/COR2:2010

IEC 60191-6-18:2010/COR2:2010

Active Most Recent

IEC 60191-6-18:2010/COR2:2010 Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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IEC 60749-19:2003/AMD1:2010

IEC 60749-19:2003/AMD1:2010

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IEC 60749-19:2003/AMD1:2010 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

€12.00

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IEC 60749-32:2002/AMD1:2010

IEC 60749-32:2002/AMD1:2010

Active Most Recent

IEC 60749-32:2002/AMD1:2010 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

€12.00

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IEC TR 62258-3:2010

IEC TR 62258-3:2010

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IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

€389.00

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IEC 60191-6-21:2010

IEC 60191-6-21:2010

Active Most Recent

IEC 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

€93.00

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IEC 60191-6-20:2010

IEC 60191-6-20:2010

Active Most Recent

IEC 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

€46.00

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IEC 62374-1:2010

IEC 62374-1:2010

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IEC 62374-1:2010 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

€93.00

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IEC 60749-15:2010

IEC 60749-15:2010

Superseded Historical

IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

€23.00

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IEC 60749-34:2010

IEC 60749-34:2010

Active Most Recent

IEC 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

€46.00

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IEC 60747-8:2010

IEC 60747-8:2010

Active Most Recent

IEC 60747-8:2010 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors

€441.00

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IEC 60747-7:2010

IEC 60747-7:2010

Active Most Recent

IEC 60747-7:2010 Semiconductor devices - Discrete devices - Part 7: Bipolar transistors

€470.00

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IEC 60747-15:2010

IEC 60747-15:2010

Superseded Historical

IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices

€186.00

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IEC 60749-23:2004/AMD1:2011

IEC 60749-23:2004/AMD1:2011

Superseded Historical

IEC 60749-23:2004/AMD1:2011 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

€12.00

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