31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
IEC 60191-2:1966/AMD18:2011

IEC 60191-2:1966/AMD18:2011

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IEC 60191-2:1966/AMD18:2011 Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 62047-10:2011/COR1:2012

IEC 62047-10:2011/COR1:2012

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IEC 62047-10:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

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IEC 62047-13:2012

IEC 62047-13:2012

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IEC 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

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IEC 62047-14:2012

IEC 62047-14:2012

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IEC 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

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IEC 62047-9:2011/COR1:2012

IEC 62047-9:2011/COR1:2012

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IEC 62047-9:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

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IEC 62047-5:2011/COR1:2012

IEC 62047-5:2011/COR1:2012

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IEC 62047-5:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

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IEC TR 62258-4:2012

IEC TR 62258-4:2012

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IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

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IEC 60191-2:2025 DB

IEC 60191-2:2025 DB

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IEC 60191-2:2025 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60749-27:2006/AMD1:2012

IEC 60749-27:2006/AMD1:2012

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IEC 60749-27:2006/AMD1:2012 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

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IEC 60191-2:1966/AMD19:2012

IEC 60191-2:1966/AMD19:2012

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IEC 60191-2:1966/AMD19:2012 Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

€186.00

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IEC 60191-6-22:2012

IEC 60191-6-22:2012

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IEC 60191-6-22:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

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IEC 60749-26:2013

IEC 60749-26:2013

Superseded Historical

IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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IEC 61954:2011/AMD1:2013

IEC 61954:2011/AMD1:2013

Superseded Historical

IEC 61954:2011/AMD1:2013 Amendment 1 - Static var compensators (SVC) - Testing of thyristor valves

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IEC 60747-5-5:2007/AMD1:2013

IEC 60747-5-5:2007/AMD1:2013

Superseded Historical

IEC 60747-5-5:2007/AMD1:2013 Amendment 1 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers

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IEC 60747-16-5:2013

IEC 60747-16-5:2013

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IEC 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

€342.00

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